BGA Rework Reballing Stencil Template for 6/
Description:
phone BGA stencil template.
High precision and not easily deformed High Quality BGA stencil template for phone BGA chips.
Each type BGA reballing stencil template support a variety of BGA IC.
Used for motherboard CPU / audio / power IC / USB control BGA .
Compatible with 6/ .
Specification:
Material: Metal
Size: Approx. 11.5*9*0.1 cm/4.53*3.54*0.04 inch
Package Includes:
1 Piece BGA Reballing Stencil